“Due to the second round of sanctions, the production of the chip will be cut off after September 15. It may be the last generation of Kirin’s high-end chip, out of print. At present, the semiconductor technology in China has not caught up. ” On the afternoon of July 7, Yu Chengdong, CEO of Huawei’s consumer business, said at the 2020 summit of the 100 people’s Conference on China’s informatization, TSMC will no longer be able to undertake Huawei’s high-end chip OEM orders after September 15, which means that Huawei’s Kirin high-end chips will soon become “out of print.”.
Yu Chengdong said Huawei will launch a new 5g mobile phone of the brand mate 40 series this autumn, and choose to carry Kirin 9000 series chips. However, this series of mobile phones may become the last generation to carry Huawei’s Kirin chip. “I’m sorry.” He said frankly that Huawei has developed in the chip field for more than ten years, from seriously backward, to a little backward, to catch up, and then to lead. This is a huge R & D investment, and the process is very difficult.
Yu added that Huawei delivered 60 million fewer smartphones in 2019 due to U.S. sanctions. “This year’s quantity is likely to be less than that, because this is the second round of sanctions on chips, which cannot be produced.” He said it is expected that mobile phone sales this year will not reach the level of 240 million units in the same period last year.
In the whole chain of chip industry, Huawei Hisilicon mainly undertakes the work of chip design. “It’s a pity that Huawei didn’t participate in semiconductor manufacturing, which is a heavy asset investment oriented industry and a capital intensive industry. We just did chip design, not chip manufacturing.” The absence in the manufacturing field directly led to Huawei’s inability to produce flagship chips after September 15, “which is a very big loss for us.”.
Yu Chengdong called on the domestic semiconductor industry chain to strengthen cooperation and quickly explore a set of methods to produce and manufacture semiconductor products under the “sanction” of the US side, so as to avoid being “necked off” in this field in a longer period of time in the future. “In the depth of China’s industrial chain, in the era of Internet and mobile Internet social network, there is still a gap between China’s core technology and the control ability of core ecology with the United States and other countries.” Because of this, “we need to build our ecology, our operating system, our ecological services, our chips, our equipment, equipment, and our entire basic system capability. For us, sanctions are painful, but at the same time, they are a major opportunity to force us to upgrade the real estate industry as soon as possible. “
At the same time, Yu Chengdong did not deny the possibility of Huawei’s own involvement in semiconductor manufacturing and other fields. “We want to make breakthroughs in EDA design, materials, manufacturing, process, design capability, manufacturing, packaging and testing, etc.” “Whether it’s overtaking on a curve or on a half, we want to be ahead in a new era,” he said. There is nothing that can’t be done in the world, only not enough determination and not enough investment.